The PHI VersaProbe 4 is a highly versatile, multi-technique instrument with PHI’s patented, monochromatic, micro-focused, scanning X-ray source. The instrument offers true SEM-like ease of operation with superior micro area spectroscopy and excellent large area capabilities. The fully integrated multi-technique platform of the PHI VersaProbe 4 offers an array of optional excitation sources, sputter ion sources, and sample treatment and transfer capabilities. These features are essential in studying today’s advanced materials and in supporting your material characterization and problem-solving needs.

The new PHI VersaProbe 4 has improved spectroscopic performance, new large area imaging and mapping capabilities, and environmentally friendly modern configuration with efficient power consumption, faster pump-down and ergonomic design.

Please visit https://www.phi.com/surface-analysis-equipment/versaprobe.html for more information.

The X2 is an advanced In-line X-RAY inspection system designed for high-speed automatic inspection in production lines. Transmission X-RAY technology is combined with patented Slice-Filter-Technology (SFT) for double-sided PCB assembly and component inspection. It features fully automated inspection based on a CAD compiled inspection list and uses an inspection model library for the test-strategy definition. The motion system as well as the image acquisition chain meets all demands of high-speed inspection.
MIPS_Tune is an off-line programming software package including automatic CAD import, CAD compile, inspection parameter setting & rule generation.
The MIPS_Verify module included in the MIPS_Process unit with its closed-loop repair concept is capable for in-line or off-line verification using a graphical board layout display and X-ray image with defect marking. MIPS-Verify can be linked to combined AOI platforms.
A test coverage display allows optimized inspection concept analyses & balancing. All relevant inspection data can be stored and maintained in a dedicated inspection data base.
Our MIPS_SPC Real Time module is providing real-time process control with immediate production line feedback.

SmartLab®
Rigaku SmartLab is the newest and most novel high-resolution X-ray diffractometer (XRD) available today. Perhaps its most novel feature is the new SmartLab Studio II software, which provides the user with an intelligent User Guidance expert system functionality that guides the operator through the intricacies of each experiment. It is like having an expert standing by your side.

Features
Available in-plane arm (5-axis goniometer)
Highest flux X-ray source: PhotonMax
HyPix-3000 high energy resolution 2D HPAD detector
New CBO family, with fully automated beam switchable CBO-Auto and high-resolution micro area CBO-μ
Operando measurements with SmartLab Studio II software
Multi-year component warranty contributes to low cost of ownership" 250 in speed and provides adjustable energy resolution of approximately 20% or 4% depending on sample type.
Integrated intelligent Guidance software enables fully automated measurement including optics and sample alignment.
Self-aligned optics maximize instrument uptime and minimize cost of ownership.

The MatriX X2.5 is an automatic inspection system designed for sophisticated high-speed inspection in SMT production. Transmission X-ray Technology with patented Slice-Filter-Technique (SFT) and Off-Axis Technology present a reliable solution for the in-line inspection of double-sided PCB assemblies. The X2.5 movable detector axes allow high-speed off-axis image acquisition from different angles and directions with maximum image quality and resolution.
MIPS_Tune is an off-line programming software package for test program generation with automatic CAD import and for graphical application parameter tuning. It features an automatic inspection list generation based on an advanced algorithm library for transmission and off-axis joint inspection.
Proprietary Tree-Classification technique with integrated automatic rule generation, graphical measurement & yield display for program optimization.
The verification software module MIPS Verify with its closed-loop repair concept is capable of in-line or offline verification using a graphical board layout display and X-ray image with defect marking. Support of multiple inspection modes with parallel viewing of transmission oblique view and optical images of the same defect for easy and reliable defect verification. MIPS_SPC – process control tools for real-time and history statistics.

The X3 is an automatic X-Ray inspection system featuring combined Transmission and 3D Technology for sophisticated high-speed inspection in electronic production. The system is based on the motion concept of the MatriX X2.5 AXI system. A newly developed 3D reconstruction software generates slice images for 3D analysis of solder joints. Main applications are double-sided boards with critical overlapping areas.
MIPS_Tune is an off-line programming software package for test program generation with automatic CAD import and for graphical application parameter tuning. It features an automatic inspection list generation based on an advanced algorithm library for transmission and off-axis joint inspection.
Proprietary Tree-Classification technique with integrated automatic rule generation, graphical
measurement & yield display for program optimization.
The verification software module MIPS Verify with its closed-loop repair concept is capable of in-line or offline verification using a graphical board layout display and X-ray image with defect marking. Support of multiple inspection modes with parallel viewing of transmission oblique view and optical images of the same defect for easy and reliable defect verification. MIPS_SPC – process control tools for real-time and history statistics.

The X-Strata920 SDD is a benchtop energy dispersive X-ray fluorescence (EDXRF) instrument for coatings and materials analysis in quality control and production control.
With reliable hardware and intuitive software, any operator can get reliable, high quality results with demanding testing requirements.

The XT-6 is a highly flexible X-ray inspection system featuring a parallel-kinematic Hexaglide manipulation unit that allows extreme off-axis X-ray transmission in the smallest of space with maximum speed and in high resolution. This technology is especially suitable for high-quality X-ray analysis of electronic assemblies as well as material analysis of parts, where flexible part manipulation with multiple inspection angles is needed. The innovative Hexapod concept with all 6 axes moving fully independently guarantees precise motion. For batch modes and volume inspections the XT-6A can be equipped with a single-sided conveyor setup and magazine load/unload station. An innovative operator terminal using space mouse and touch-screen underlines the “ease to use” user interface concept.
MIPS_Analyzer is an advanced software package for manual and automatic X-ray inspection solutions, supporting Teach-Mode and CAD import for an optimum inspection sequence generation. The image capturing is fully programmable via acquisition types and image-filter tool bar, guaranteeing repeatable imaging quality and measurements. An advanced algorithm library for solder-joints and material analysing is part of the standard image processing package. Customized algorithms are optionally available upon request.
The proprietary Tree-Classification (ATC) technique with integrated manual and automatic rule generation can be used for automatic detection including graphical measurement & yield display.
The verification software module MIPS_Verify with its closed-loop repair concept can be adapted together with the XT-6A model-type. The verification user interface includes a graphical board layout display and X-ray image with defect marking and easy access to a customized defect image library.

The Vanta analyzer is our most advanced handheld X-ray fluorescence (XRF) device and provides rapid, accurate element analysis and alloy identification to customers who demand laboratory-quality results in the field.

Vanta handheld XRF analyzers are built to be tough. Their rugged and durable design makes them resistant to damage for greater uptime and a lower cost of ownership.

With intuitive navigation and configurable software, the Vanta series are easy to use with minimal training for high throughput and a fast return on investment. Featuring innovative and proprietary Axon technology, Vanta analyzers give you accurate results and help boost productivity no matter the environment or working conditions.

Exceptional durability under extreme conditions.
Analytical superiority.
Optional Wireless LAN and Bluetooth® for real-time data sharing. Cloud technology enabled.
Intuitive user interface.

The DELTA Element is the most affordable unit in the Olympus line-up of handheld X-ray fluorescence (XRF) analyzers designed for fast, accurate results. Fast, simple and reliable, the DELTA Element incorporates the features and rugged design of the DELTA family. With fast elemental ID for screening, sorting and metal analysis, the DELTA Element provides fast ROI for Scrap, PMI, QA / QC and Jewelry / Precious Metals applications.

With a powerful X-ray tube and Si-PIN detector, the DELTA Element is ideal for simple applications. It provides quick ID, screening, sorting and elemental and metal analysis.

The DELTA Element offers fast measurement with results in seconds, low limits of detection, and outstanding precision.

The DELTA Element's field-worthy and rugged design features rubber overmolds and an ergonomic grip to protect the analyzer. To avoid downtime, the hot swap feature allows the batteries to be swapped out while the analyzer is in use. The DELTA Element features wide area heat sinks for high power use in extreme temperatures.

Olympus' exclusive Grade Match Messaging (GMM) feature provides information to simplify verification and streamline operations. Users can assign customized messages to any grade and use real-time or pop-up messages for immediate sorting instructions and improved user efficiency.

The XCT-1000 series systems meet the most stringent demands in CT X-ray. With this Computed Tomography system, MatriX Technologies GmbH offers the highest possible flexibility for individual customer requirements. This space-saving system can be equipped with different X-ray powers, from 130kV up to 190kV with nano/micrometer resolution. The XCT-1000 is especially suitable for the inspection of small to medium production volumes or for the use in laboratory environment.
The XCT-1000 systems are capable of processing the Siemens CERA-TXR technique with exact
Volume reconstruction by using the latest CMPtechnology for automatic geometrical correction
and calibration. This fast, real-time CT reconstruction technique provides cone artefact free images with automatic volume slice separation and automatic analysing functionalities.
The flexible manipulator system allows different and optimized magnification-setups depend on
sample sizes and geometry.
The XCT-1000 system is ideal for non-destructive testing, materials investigations and, in particular,
dimensional measurements for internal structures, undercuts and free form surfaces.

The FOX-IQ in-line analyzer provides customizable, continuous measurements of titanium (Ti) to uranium (U) on any surface. Designed to operate 24/7, the FOX-IQ XRF system performs fully automated in-line analysis for 100% high-volume process control.

X-ray fluorescence (XRF) is a proven technique used to quickly and nondestructively verify alloy grade and chemistry. The FOX-IQ system is compact and has minimal power requirements, making it easy to integrate with new or existing PLC-controlled processes. The system is engineered to endure high levels of vibration, electromagnetic and acoustical noise, dust, and moisture.

Each FOX-IQ system delivers pass/fail results, accurate grade identifications, and material chemistry. It can be controlled by a PC or integrated with a PLC for automated start/stop, data acquisition, decision-making, and communication to external devices.

New 6th generation MiniFlex benchtop X-ray diffractometer is a multipurpose powder diffraction analytical instrument that can determine: crystalline phase identification (phase ID) and quantification, percent (%) crystallinity, crystallite size and strain, lattice parameter refinement, Rietveld refinement, and molecular structure. It is widely used in research, especially in material science and chemistry, as well as in industry for research and quality control. It is the newest addition to the MiniFlex series of benchtop X-ray diffraction analyzers from Rigaku, which began with the introduction of the original MiniFlex XRD system decades ago.

Measurements:
Phase identification
Phase quantification (phase ID)
Percent (%) crystallinity
Crystallite size and strain
Lattice parameter refinement
Rietveld refinement
Molecular structure

The XT-3 is a high-resolution manual x-ray inspection system designed to address fast intuitive operation, low volume production capacity, and advanced failure analysis for SMT production inspection and quality control protocols. This system addresses more complex SMT solder-joint and semiconductor inspection and analysis. It is easy to learn and easy to use by all production floor operators, technicians, and engineers. The small footprint allows passage through a standard door width. This system offers exceptional image quality and together with the MatriX Image Processing Software (MIPS) provides industry leading analyzing and automated inspection for BGA, QFN, and Pin-in-Paste or Through-Hole Barrel Fill detection.
MIPS_Analyzer is an advanced inspection software package for manual and semi-automated x-ray inspection solutions. Supporting teach-mode with programmable inspection positions. The image capturing is fully programmable via acquisition types and image-filter tool bar. It guarantees repeatable imaging quality and measurements.
An advanced algorithm library for solder-joints and material analysing is part of the standard image processing package. Customized algorithms are optionally available upon request.

"Quadra 5 excels at challenging workflows.
0.35 µm feature recognition and higher output power open up additional high resolution bond wire, package level inspection and failure analysis capabilities."

"With 0.95 µm feature recognition and X-Plane image slice technology, Quadra 3 is perfectly designed for PCBA production line quality control.
Inspect BGA and QFN attachment, solder shorts, PTH filling and detect counterfeit components."

The TERRA Mobile XRD System, a high performing, completely contained, battery operated, closed-beam portable XRD, provides full phase ID of major, minor and trace components with a qualitative XRF scan of elements Ca - U. Its unique, minimal sample prep technique and sample chamber allow for fast, in-field analysis.

PHI’s patented Parallel Imaging MS/MS mass spectrometer provides superior sensitivity, low spectral background, unique ability to image highly topographic surfaces, high mass accuracy and mass resolution, and unambiguous peak identification with parallel tandem MS imaging capability. The PHI nanoTOF 3 can be configured with a wide variety of options to optimize performance for organic materials, inorganic materials, or both, depending on customer requirements.

Please visit https://www.phi.com/surface-analysis-equipment/nanotof.html for more information.

As a tube-above sequential wavelength dispersive X-ray fluorescence (WDXRF) spectrometer, the new Rigaku ZSX Primus IV delivers rapid quantitative determination of major and minor atomic elements, from beryllium (Be) through uranium (U), in a wide variety of sample types with minimal standards. ZSX Guidance supports you in all aspects of XRF measurement and data analysis, combined with the most advanced mapping package to detect homogeneity and inclusions

The new Supermini200 has improved software capabilities as well as a better footprint. As the world's only high-power benchtop sequential wavelength dispersive X-ray fluorescence (WDXRF) spectrometer for elemental analysis of oxygen (O) through uranium (U) of almost any material, the Rigaku Supermini200 uniquely delivers low cost-of-ownership (COO) with high resolution and lower limits-of-detection (LLD).

The newest version of our popular multi-channel simultaneous wavelength dispersive X-ray fluorescence (WDXRF) spectrometer system is the Simultix 14. Based on over 30 years of accumulated experience, the Simultix 14 stands out as the most advanced, fully automated system available — designed to meet today's analytical needs for utmost sensitivity, throughput, and versatility.

Nordson DAGE, the only x-ray company whose focus is on x-ray electronics inspection, offers the Nordson DAGE XD7500VR Jade FP x-ray inspection system that uses the latest technology flat panel detector to provide the market leading, cost effective approach where high quality real time imaging is needed for production tasks. With a great specification, this foundation platform easily outperforms the competition.
The Nordson DAGE open, transmissive x-ray tube, with its long lifetime filament technology, together with the high quality 1.33 Mpixel CMOS flat panel detector makes this jewel of a system provide the most cost effective choice in terms of price and performance for the high magnification and high resolution real-time imaging necessary for electronics inspection. The vertical system configuration, with the x-ray tube sitting below the isocentric ‘move and tilt’ of the detector, all controlled through the simple, joystick-free, ‘point and click’ software. This provides the safe and collision-free inspection for production applications. All these tasks can be simply and quickly automated without the need for programming skills.

Nordson DAGE, the only x-ray company whose focus is on x-ray electronics inspection, offers the Nordson DAGE XD7600NT Ruby FP x-ray inspection system that uses the latest technology, flat panel detector to provide the first choice for high quality real time imaging in production.
The unique Nordson DAGE NT maintenance-free, sealed transmissive x-ray tube, providing 0.5 μm feature recognition and up to 10 W of target power, together with the 2 Mpixel long lifetime CMOS flat panel detector makes this jewel of a system the choice for high performance and high magnification real-time imaging. The vertical system configuration, with the x-ray tube sitting below the isocentric ‘move and tilt’ of the detector, all controlled through the simple, joystick-free, ‘point
and click’ operation of the Nordson DAGE Image Wizard Software provides the safe and collision-free inspection required for production applications. All these tasks can be simply and quickly automated from within the standard Nordson DAGE software without the need for programming
skills. Optional upgrades include μCT.

"Quadra™ Series X-ray inspection takes you beyond optical imaging. Proprietary QuadraNT sealed X-ray tube technology allows you to non-destructively inspect obscured areas inside devices and components at up to 68,000 times magnification. Ultimate image quality at 0.1 µm feature recognition, Quadra 7 is the most capable X-ray tool on the market for failure analysis and production quality control.
With component and board sizes getting smaller all the time, Quadra 7 ensures your quality needs are met today, and well into the future."

The SmartLab 3 is a highly versatile multipurpose X-ray diffractometer with built-in intelligent guidance. It offers continued refinement of the original ease of use features that enabled the original SmartLab to receive the R&D 100 Award in 2006: automatic alignment, component recognition, cross beam optics and a five axis goniometer.

ZSX Primus
Rigaku ZSX Primus delivers rapid quantitative determination of major and minor atomic elements, from beryllium (Be) through uranium (U), in a wide variety of sample types — with minimal standards.

Features
Analysis of elements from Be to U
Small footprint uses less valuable lab space
Micro analysis to analyze samples as small as 500 μm
Tube-below design is optimized for liquids and loose powders
30μ tube delivers superior light element performance
Mapping feature for elemental topography/distribution
Helium seal means the optics are always under vacuum

Coating thickness measurement and materials analysis to improve process and quality control with X-ray fluorescence (XRF)

The X-Strata is a compact, rugged and reliable quality control XRF benchtop system for simple, rapid, non-destructive coating thickness measurement and materials analysis.

It performs excellent coating thickness analysis and characterisation of multi-layer analysis across a wide range of industrial markets, including electronics, metal finishing, alloys and precious metals assay.