The X2 is an advanced In-line X-RAY inspection system designed for high-speed automatic inspection in production lines. Transmission X-RAY technology is combined with patented Slice-Filter-Technology (SFT) for double-sided PCB assembly and component inspection. It features fully automated inspection based on a CAD compiled inspection list and uses an inspection model library for the test-strategy definition. The motion system as well as the image acquisition chain meets all demands of high-speed inspection.
MIPS_Tune is an off-line programming software package including automatic CAD import, CAD compile, inspection parameter setting & rule generation.
The MIPS_Verify module included in the MIPS_Process unit with its closed-loop repair concept is capable for in-line or off-line verification using a graphical board layout display and X-ray image with defect marking. MIPS-Verify can be linked to combined AOI platforms.
A test coverage display allows optimized inspection concept analyses & balancing. All relevant inspection data can be stored and maintained in a dedicated inspection data base.
Our MIPS_SPC Real Time module is providing real-time process control with immediate production line feedback.

The MatriX X2.5 is an automatic inspection system designed for sophisticated high-speed inspection in SMT production. Transmission X-ray Technology with patented Slice-Filter-Technique (SFT) and Off-Axis Technology present a reliable solution for the in-line inspection of double-sided PCB assemblies. The X2.5 movable detector axes allow high-speed off-axis image acquisition from different angles and directions with maximum image quality and resolution.
MIPS_Tune is an off-line programming software package for test program generation with automatic CAD import and for graphical application parameter tuning. It features an automatic inspection list generation based on an advanced algorithm library for transmission and off-axis joint inspection.
Proprietary Tree-Classification technique with integrated automatic rule generation, graphical measurement & yield display for program optimization.
The verification software module MIPS Verify with its closed-loop repair concept is capable of in-line or offline verification using a graphical board layout display and X-ray image with defect marking. Support of multiple inspection modes with parallel viewing of transmission oblique view and optical images of the same defect for easy and reliable defect verification. MIPS_SPC – process control tools for real-time and history statistics.

The X3 is an automatic X-Ray inspection system featuring combined Transmission and 3D Technology for sophisticated high-speed inspection in electronic production. The system is based on the motion concept of the MatriX X2.5 AXI system. A newly developed 3D reconstruction software generates slice images for 3D analysis of solder joints. Main applications are double-sided boards with critical overlapping areas.
MIPS_Tune is an off-line programming software package for test program generation with automatic CAD import and for graphical application parameter tuning. It features an automatic inspection list generation based on an advanced algorithm library for transmission and off-axis joint inspection.
Proprietary Tree-Classification technique with integrated automatic rule generation, graphical
measurement & yield display for program optimization.
The verification software module MIPS Verify with its closed-loop repair concept is capable of in-line or offline verification using a graphical board layout display and X-ray image with defect marking. Support of multiple inspection modes with parallel viewing of transmission oblique view and optical images of the same defect for easy and reliable defect verification. MIPS_SPC – process control tools for real-time and history statistics.

The XT-6 is a highly flexible X-ray inspection system featuring a parallel-kinematic Hexaglide manipulation unit that allows extreme off-axis X-ray transmission in the smallest of space with maximum speed and in high resolution. This technology is especially suitable for high-quality X-ray analysis of electronic assemblies as well as material analysis of parts, where flexible part manipulation with multiple inspection angles is needed. The innovative Hexapod concept with all 6 axes moving fully independently guarantees precise motion. For batch modes and volume inspections the XT-6A can be equipped with a single-sided conveyor setup and magazine load/unload station. An innovative operator terminal using space mouse and touch-screen underlines the “ease to use” user interface concept.
MIPS_Analyzer is an advanced software package for manual and automatic X-ray inspection solutions, supporting Teach-Mode and CAD import for an optimum inspection sequence generation. The image capturing is fully programmable via acquisition types and image-filter tool bar, guaranteeing repeatable imaging quality and measurements. An advanced algorithm library for solder-joints and material analysing is part of the standard image processing package. Customized algorithms are optionally available upon request.
The proprietary Tree-Classification (ATC) technique with integrated manual and automatic rule generation can be used for automatic detection including graphical measurement & yield display.
The verification software module MIPS_Verify with its closed-loop repair concept can be adapted together with the XT-6A model-type. The verification user interface includes a graphical board layout display and X-ray image with defect marking and easy access to a customized defect image library.

The XCT-1000 series systems meet the most stringent demands in CT X-ray. With this Computed Tomography system, MatriX Technologies GmbH offers the highest possible flexibility for individual customer requirements. This space-saving system can be equipped with different X-ray powers, from 130kV up to 190kV with nano/micrometer resolution. The XCT-1000 is especially suitable for the inspection of small to medium production volumes or for the use in laboratory environment.
The XCT-1000 systems are capable of processing the Siemens CERA-TXR technique with exact
Volume reconstruction by using the latest CMPtechnology for automatic geometrical correction
and calibration. This fast, real-time CT reconstruction technique provides cone artefact free images with automatic volume slice separation and automatic analysing functionalities.
The flexible manipulator system allows different and optimized magnification-setups depend on
sample sizes and geometry.
The XCT-1000 system is ideal for non-destructive testing, materials investigations and, in particular,
dimensional measurements for internal structures, undercuts and free form surfaces.

The XT-3 is a high-resolution manual x-ray inspection system designed to address fast intuitive operation, low volume production capacity, and advanced failure analysis for SMT production inspection and quality control protocols. This system addresses more complex SMT solder-joint and semiconductor inspection and analysis. It is easy to learn and easy to use by all production floor operators, technicians, and engineers. The small footprint allows passage through a standard door width. This system offers exceptional image quality and together with the MatriX Image Processing Software (MIPS) provides industry leading analyzing and automated inspection for BGA, QFN, and Pin-in-Paste or Through-Hole Barrel Fill detection.
MIPS_Analyzer is an advanced inspection software package for manual and semi-automated x-ray inspection solutions. Supporting teach-mode with programmable inspection positions. The image capturing is fully programmable via acquisition types and image-filter tool bar. It guarantees repeatable imaging quality and measurements.
An advanced algorithm library for solder-joints and material analysing is part of the standard image processing package. Customized algorithms are optionally available upon request.

Nordson DAGE, the only x-ray company whose focus is on x-ray electronics inspection, offers the Nordson DAGE XD7500VR Jade FP x-ray inspection system that uses the latest technology flat panel detector to provide the market leading, cost effective approach where high quality real time imaging is needed for production tasks. With a great specification, this foundation platform easily outperforms the competition.
The Nordson DAGE open, transmissive x-ray tube, with its long lifetime filament technology, together with the high quality 1.33 Mpixel CMOS flat panel detector makes this jewel of a system provide the most cost effective choice in terms of price and performance for the high magnification and high resolution real-time imaging necessary for electronics inspection. The vertical system configuration, with the x-ray tube sitting below the isocentric ‘move and tilt’ of the detector, all controlled through the simple, joystick-free, ‘point and click’ software. This provides the safe and collision-free inspection for production applications. All these tasks can be simply and quickly automated without the need for programming skills.

Nordson DAGE, the only x-ray company whose focus is on x-ray electronics inspection, offers the Nordson DAGE XD7600NT Ruby FP x-ray inspection system that uses the latest technology, flat panel detector to provide the first choice for high quality real time imaging in production.
The unique Nordson DAGE NT maintenance-free, sealed transmissive x-ray tube, providing 0.5 μm feature recognition and up to 10 W of target power, together with the 2 Mpixel long lifetime CMOS flat panel detector makes this jewel of a system the choice for high performance and high magnification real-time imaging. The vertical system configuration, with the x-ray tube sitting below the isocentric ‘move and tilt’ of the detector, all controlled through the simple, joystick-free, ‘point
and click’ operation of the Nordson DAGE Image Wizard Software provides the safe and collision-free inspection required for production applications. All these tasks can be simply and quickly automated from within the standard Nordson DAGE software without the need for programming
skills. Optional upgrades include μCT.

"Quadra™ Series X-ray inspection takes you beyond optical imaging. Proprietary QuadraNT sealed X-ray tube technology allows you to non-destructively inspect obscured areas inside devices and components at up to 68,000 times magnification. Ultimate image quality at 0.1 µm feature recognition, Quadra 7 is the most capable X-ray tool on the market for failure analysis and production quality control.
With component and board sizes getting smaller all the time, Quadra 7 ensures your quality needs are met today, and well into the future."