• DUAL BEAM / SEM / FIB
    Versa 3D Dual Beam

    Building on the history and success of FEI's pioneering DualBeam, low vacuum and ESEM™ expertise, FEI introduces the most versatile DualBeam instrument to date. The Versa 3D offers state-of-the-art imaging and analytical performance to deliver a greater range of 3D data from even your most challenging samples.

    Versa 3D's highly configurable platform allows customers to adapt the system's capabilities to their specific requirements. The combination of high and low vacuum modes gives the flexibility to work with a range of samples including uncoated and non-conductive samples. Optional ESEM mode allows electron beam imaging of naturally hydrated samples and supports in situ analysis and experimentation with additional dynamic temperature stages.

  • DUAL BEAM / SEM / FIB / EXTREME HIGH RESOLUTION (XHR)
    Helios Nanolab

    The Helios NanoLab™ DualBeam™ has always combined FEI's best electron and ion optics, accessories and software to deliver a powerful solution for advanced nanoscale research. For scientists working at nanotechnology's leading edge, Helios NanoLab lets them push boundaries and create new possibilities for materials research.

    With highly valued sub-nm SEM imaging, the capability to produce ultra-thin samples for S/TEM, and the most precise prototyping capabilities, scientists choose the Helios NanoLab as their partner for innovating new materials and nanoscale devices that will influence future advancements.

  • DUAL BEAM / SEM / FIB / ULTRA HIGH RESOLUTION (UHR)
    Scios Dual Beam

    FEI Scios™ is an ultra-high-resolution analytical DualBeam™ system that delivers outstanding 2D and 3D performance for a broad range of samples, including magnetic material. With innovative features designed to increase throughput, precision, and ease of use, the FEI Scios is ideal for advanced research and analysis across academic, government, and industrial research environments.

    Advanced detection technology is at the very core of the FEI Scios. In-lens FEI Trinity™ detection technology collects all signals simultaneously, saving time and offering distinctly different contrasts to capture the maximum amount of data. An innovative, under-the-lens concentric backscatter detector enhances efficiency, enabling you to select a signal based on its angular distribution to easily separate materials and topographic contrast-even at 20 eV landing energy.

  • FIB (PLASMA) / MILLING / ELECTRONICS
    Vion Plasma FIB

    The FEI Vion™ Plasma Focused Ion Beam System (PFIB) adds significantly more capacity to your lab, with best-in-class milling and imaging performance in a single, easy-to-use instrument. By incorporating plasma ion source technology, the Vion PFIB delivers increased throughput over conventional gallium FIB instruments-with speeds more than 20x faster for site-specific cross-sectioning and large area milling, as well as sample preparation. With both excellent milling precision and high-resolution imaging at low beam currents, the Vion PFIB delivers the speed, accuracy and high contrast images essential for a wide range of process control, failure analysis or materials research applications.

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