• Surface Analysis
    PHI VersaProbe 4

    The PHI VersaProbe 4 is a highly versatile, multi-technique instrument with PHI’s patented, monochromatic, micro-focused, scanning X-ray source. The instrument offers true SEM-like ease of operation with superior micro area spectroscopy and excellent large area capabilities. The fully integrated multi-technique platform of the PHI VersaProbe 4 offers an array of optional excitation sources, sputter ion sources, and sample treatment and transfer capabilities. These features are essential in studying today’s advanced materials and in supporting your material characterization and problem-solving needs.

    The new PHI VersaProbe 4 has improved spectroscopic performance, new large area imaging and mapping capabilities, and environmentally friendly modern configuration with efficient power consumption, faster pump-down and ergonomic design.

    Please visit https://www.phi.com/surface-analysis-equipment/versaprobe.html for more information.

  • (1) STYLUS PROFILER
    Dektak XT

    The gold standard in stylus profiling

    The DektakXT® stylus profilometer features a revolutionary benchtop design that enables an unmatched repeatability of 4Å and up to 40% improvement in scanning speeds. This major milestone in stylus profiler performance is the culmination of over fifty years of Dektak® innovation and industry leadership. Through its combination of industry firsts, DektakXT delivers the ultimate in performance, ease of use, and value to enable better process monitoring from R&D to QC. The technological breakthroughs incorporated in DektakXT enable critical nanometer-level surface measurements for the microelectronics, semiconductor, solar, high-brightness LED, medical, and materials science industries.

    4 angstrom
    repeatability
    Delivers industry-leading accuracy.

    Single-arch
    design
    Provides breakthrough scan stability.

    Self-aligning
    styli
    Enables effortless tip exchange.

    FEATURES

    Accelerating Data Collection and Analysis
    Utilizing a unique direct-drive scan stage, the DektakXT accelerates measurement scan times by 40% while maintaining industry-leading performance. Vision64, Bruker’s 64-bit parallel processing operation and analysis software, enables faster loading of 3D files and faster applications of filters and multiscan database analyses.

    Delivering the Most Repeatable Measurements
    Implementing a single-arch structure makes the DektakXT sturdier, which minimizes the effects of environmental noise. DektakXT’s upgraded “smart electronics” reduce temperature variations and employ modern processors that minimize error-inducing noise, allowing it to be an even more robust system capable of measuring <10nm step heights.

    Perfecting Operation and Analysis
    Bruker’s Vision64 software complements DektakXT’s innovative design by providing the most intuitive and streamlined visual user interface. The combination of intelligent architecture and customizable automation capabilities allow for fast and comprehensive data collection and analysis. Whether you’re using a recipe to perform routine analysis on single scans, or applying custom filters settings and calculations, DektakXT’s Data Analyzer displays current data while also revealing other possible analyses.

    Making Things Easy
    The DektakXT’s self-aligning stylus assembly allows the user to quickly and easily change stylus size while eliminating any potential mishaps during the process. Bruker offers the widest range of stylus sizes to accommodate nearly any application need.

    Ensuring High Yield
    DektakXT provides the ability to quickly and easily set up and run automated multi-site measurement routines to verify the precise thickness of thin films across the wafer surface with unmatched repeatability. This efficient monitoring can save valuable time and money by improving yields.

    For more information please visit:
    https://www.bruker.com/en/products-and-solutions/test-and-measurement/stylus-profilometers/dektakxt.html

  • (2) STYLUS PROFILER / LARGE SAMPLE
    Dektak XTL

    Gage-capable QA/QC profiler for optimal 300mm performance

    The Dektak XTL™ stylus profilometer accommodates samples up to 350mm x 350mm, bringing legendary Dektak® repeatability and reproducibility to large-format wafer and panel manufacturing. The Dektak XTL features pneumatic vibration isolation and a fully enclosed workstation with easily accessible interlocking door, making it ideal for today’s demanding production floor environments. Its dual-camera architecture enables enhanced spatial awareness, and its high level of automation maximizes manufacturing throughput.

    Robust
    automation setup and operation
    Programs fiducials and unlimited measurement sites to maximize throughput and minimize errors.

    Dual
    camera control
    Simplifies measurement setup and navigation to points of interest faster.

    Easy
    analysis and data collection
    Automates analysis routines and reports only desired features on complex samples.

    FEATURES

    Industry's Best Automation and Analysis Software
    Enhanced software features make the Dektak XTL the most powerful, easiest to use stylus profiler available. The system utilizes Vision64 software that enables unlimited measurement sites, 3D mapping, and highly customized characterization with hundreds of built-in analysis tools. Vision Microform software also measures shapes, such as radius of curvature. Pattern recognition minimizes operator error and enhances measurement location accuracy. The all-in-one software package combines data collection and analysis with an intuitive workflow.

    Unmatched Stylus Technology
    The Dektak XTL builds upon over 50 years of stylus expertise and application customization for production facilities to meet the stringent industry roadmaps of both today and tomorrow. The 300-millimeter, high-accuracy encoded XY staging gives manufacturers a reliable tool to meet stringent gage R&R requirements. Dektak’s Dual Camera Control with high-magnification dual view cameras offers enhanced spatial awareness. Point-and-click positioning in the live video allows operators to quickly place samples at the right location for quick and easy measurement setup and automation programming. The system’s large interlocked door provides safe and easy access for sample loading/unloading.

    Other hardware features include:

    • Single-arch architecture and integrated vibration isolation for industry-leading performance
    • Quick-change self-aligning stylus
    • High-accuracy encoded XY stage for faster automated data collection
    • N-Lite low force with Soft Touch technology and 1mm measurement range can be used simultaneously to measure delicate and high-vertical range samples

    For more information, please visit:
    https://www.bruker.com/en/products-and-solutions/test-and-measurement/stylus-profilometers/dektak-xtl.html

  • AUGER ELECTRON SPECTROSCOPY (AES) / SURFACE ANALYSIS / SPECTRAL ANALYSIS
    PHI 710

    Auger Electron Spectroscopy (AES, Auger) is an analytical technique that provides compositional and distributional information of elements on the top few monolayers of a material by irradiating an electron beam to the surface of a solid material and measuring the energy of Auger electron emitted from the sample surface. The PHI 710 Scanning Auger Nanoprobe is a high performance surface analysis system that provides nanometer level Auger analysis. The acoustic enclosure and the built-in vibration isolators allow compositional and distributional measurement by 500,000 magnification that conventional Auger system never achieved.

  • Surface Analysis
    PHI nanoTOF III

    PHI’s patented Parallel Imaging MS/MS mass spectrometer provides superior sensitivity, low spectral background, unique ability to image highly topographic surfaces, high mass accuracy and mass resolution, and unambiguous peak identification with parallel tandem MS imaging capability. The PHI nanoTOF 3 can be configured with a wide variety of options to optimize performance for organic materials, inorganic materials, or both, depending on customer requirements.

    Please visit https://www.phi.com/surface-analysis-equipment/nanotof.html for more information.

  • XPS / SURFACE ANALYSIS / AUTOMATED
    PHI Quanterra II

    The Quantera II is the next generation of PHI’s highly successful scanning XPS microprobe product line. The Quantera II provides high sensitivity large and micro-area spectroscopy, superior inorganic and organic depth profiling, and the fully automated analysis of insulating or conductive samples.

    Important features of the Quantera II include:
    High sensitivity large area spectroscopy
    High performance micro-area spectroscoy
    Patented scanning x-ray source with a < 7.5 µm minimum beam size
    Secondary electron and XPS imaging
    Highest performance inorganic and organic sputter depth profiling
    Optional C 60 sputter ion gun
    Hands-off dual beam charge neutralization
    Robust ""Auto-Z"" sample alignment
    Robotic sample handling
    Fully automated and internet ready for remote operation
    Micro area spectroscopy and high performance thin film analysis capabilities open new areas of application for XPS surface analysis in all environments. The complete automation of the system makes it easy to use and increases the reproducibility of routine measurements. Large sample platens make it possible to analyze “real world” large samples or multiple small samples automatically. A new generation of XPS surface analysis instruments are available today from PHI.

  • XPS / SURFACE ANALYSIS / MID-RANGE
    PHI X-Tool

    The PHI X-tool is the newest member of PHI’s suite of XPS instruments that also includes the PHI Quantera II and PHI VersaProbe II. The X-tool is designed to make XPS instrumentation accessible to a larger audience. An intuitive touch screen user interface, automatic sample loading, automatic analysis, and automatic report generation removes the requirement to be a surface analysis expert to perform XPS measurements.

    Based on PHI’s patented scanning XPS microprobe technology, the X-tool provides a robust environment for performing routine small and large area XPS measurements.

    In the automatic mode of operation a turnkey recipe driven analysis capability for repetitive analysis tasks or process monitoring is provided.

    In the interactive mode of operation, the user can define analysis conditions and guide an interactive research or failure analysis oriented analysis session. Analysis capabilities include: small and large area spectroscopy, XPS mapping, and sputter depth profiling. An internal optical microscope and x-ray beam induced secondary electron imaging are available to guide the selection of areas for analysis.

    If your XPS application is centered around repetitive analysis tasks or the need to make XPS available to a large group of users, the X-tool was designed for you.

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