Dektak XT

    The Dektak XT™ stylus profiler features a revolutionary design that enables unmatched repeatability of four angstroms (4Å) and up to 40% improved scanning speeds.

    This major milestone in stylus profiler performance is the culmination of forty years of Dektak brand innovation and industry leadership. The remarkable breakthroughs incorporated in this tenth-generation Dektak system enable the critical nanometer-level film, step and surface measurements that will power future advances in the microelectronics, semiconductor, solar, high-brightness LED, medical, scientific and materials science markets.

    Building on the knowledge and experience from more than forty years of stylus profiling innovations, the Dektak XT incorporates a powerful combination of industry firsts, including a unique single-arch design and smart electronics for unmatched repeatability and performance, HD true color camera for enhanced image resolution and clarity, and a 64-bit parallel processing software architecture.

    Unmatched performance and better than 4Å repeatability
    The Dektak XT features an innovative single-arch design that delivers breakthrough platform stability. This is combined with leading-edge "smart electronics" that establish a new low-noise benchmark for stylus profiling. Finally, the Dektak XT’s new hardware configuration offers 40% shorter collection times than prior generations.

    Unprecedented efficiency and ease of use
    The Dektak XT is equipped with Bruker’s intuitive Vision64™ user interface, which simplifies workflow and operation to make the profiler easier than ever to use for advanced analysis. In addition, the system’s self-aligning styli enables effortless tip exchange, while the profiler’s single sensor design enables the widest range of capabilities in a single platform.

    Incomparable value from the world leader in stylus profilers
    In addition to premier performance in an affordable package, the Dektak XT is available with the full complement of accessories to extend versatility and tailor the system to your specific application.

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    UMT TriboLab

    Bruker’s Universal Mechanical Tester (UMT) platform has been the most versatile and widely used tribometer on the market since the first model debuted in 2000. Now, newly designed from the ground up, the UMT TriboLab™ builds on that legacy of versatility with a unique modular concept that harnesses more functionality than ever before—all without any compromise in performance.

    In fact, the UMT TriboLab offers higher speeds, more torque, and better force measurement than any of its predecessors or competitors, plus it introduces powerful new features for improved efficiency and ease-of-use. TriboLab can perform practically every common tribological test on nano and micro scales. Due to its range of testing abilities and multiple possible configurations, it is used extensively across a wide variety of industries, including biomedical, microelectronics, paper, and coatings, and throughout common industrial processes in petroleum, aerospace, automobile, engine, bearing, and fastener manufacturing.

    Today, most instruments available for tribology testing are single-function testers, and none are designed with the same range of versatile modularity as the UMT TriboLab. Within minutes the platform can be transformed from rotary to reciprocating motion, from sub-newton to kilonewton force measurement, or from room temperature up to 1000°C for environmental testing.

    The key element in TriboLab’s new design is a high-performance motor mounted in the center of a proprietary vibration-dampened column. This motor accommodates the full range of speeds and torques. Four interchangeable mechanical drives translate this power into linear and rotary motion to provide a wide selection of rotary, reciprocating, block-on-ring, and linear tribology and scratch-test configurations. With mechanical testers from other manufacturers, this much flexibility would require having multiple testers on site.

    TriboLab can be custom configured to meet your individual real-world testing needs:
    • Selection of versatile modular drives
    • Choice of high-load, high-performance sensors
    • Wide range of temperature and environment accessories

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    Dektak XTL

    The new Dektak XTL™ stylus profiler provides extremely accurate, repeatable, and reproducible metrology for a wide range of applications. With its ability to accommodate samples up to 350mm x 350mm, this system finally brings legendary Dektak performance to 200mm and 300mm wafer manufacturing.

    The Dektak XTL features a small footprint and integrated isolation with interlocking doors, making it ideal for today's demanding production floor environments. Its dual-camera architecture enables enhanced spatial awareness, and its high level of automation enhances manufacturing throughput. Bruker's exclusive Vision64 advanced production interface with optional pattern recognition makes data collection an intuitive and repeatable process, and minimizes operator-to-operator variability.

    With its unique combination of superior performance and ease of use the Dektak XTL is the new standard for industrial thin film deposition monitoring in touch-panel, solar, flat panel display and semiconductor industries for research and QA/QC.

    Analyzes large samples
    • Encoded 300mm X/Y stage
    • Accommodates 200 & 300mm wafers
    • Up to 350mm x 350mm panels

    Industrial design
    • Integrated isolation platform
    • Incorporated keyboard/monitor
    • Small footprint workstation

    Optimized features for QA/QC
    • Pattern recognition
    • Advanced production interface
    • Interlocked doors
    • Localized GUI
    • Auto-ready kit for SECS/GEM

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    Rapid, Flexible and Highly Accurate Mechanical Testing
    • Decades of design excellence form the foundation for customer-centric, high performance
    • Innovative hardware and software, including ultra-low load capability, dynamic testing, and AFM imaging, ensure highly accurate test results
    • Superior system design includes real-time control of all environmental variables during testing
    • Intrinsic flexibility in an all-inclusive test system—no extra add-ons or accessories to purchase
    • User-friendly software and an intuitive GUI provide a fast, easy path to accurate data

    In the NanoForce™ Nanomechanical Testing System, Bruker has combined the superlative capabilities of its industry-leading micro and nano mechanical testers with the outstanding imaging and nanoscale characterization abilities of atomic force microscopy (AFM).

    NanoForce offers the most advanced technology in quasistatic and dynamic indentation capabilities, plus additional functionality unique to AFM, with the most user-friendly, feature-rich design available in a nanomechanical testing system. This powerful combination results in unprecedented ability from a single tool: high precision demanded for nanoscale investigation along with detailed and accurate nanoscale properties characterization, plus the flexibility, ruggedness, and reliability needed for mechanical testing. With NanoForce you get nanomechanical testing capabilities that go far beyond nanoindentation, enabling real innovations in materials science.

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    Bruker CP-4 CMP

    The new Bruker CP-4 CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost effective characterization of wafer polishing processes.
    • Reproduces full-scale wafer polishing-process conditions
    • Provides unmatched measurement repeatability and detail
    • Performs tests on small coupons rather than whole wafers for substantial cost savings

    CMP process development for new materials and research into new CMP consumables (pads, slurries, and conditioning disks) are expensive to perform on full-scale production CMP systems. This is due to the combined cost of test wafers, consumables, overhead, depreciation, and lost productivity when running tests instead of production wafers.

    Bruker’s CP-4 provides the flexibility, control and repeatability to perform studies on coupons cut from larger wafers, resulting in substantial savings. Built on the industry-leading UMT TriboLab™ platform, CP-4 offers higher speeds, more torque, and better force measurement for CMP applications than any of its predecessors or competitors.

    The CP-4 system’s accuracy and measurement repeatability enables the highly effective qualification, inspection, and ongoing functionality testing required throughout the CMP process. It’s the only tool on the market that can provide the broad polishing pressure range (0.05-50 psi), speeds (1 to 500 rpm), acoustic emissions, friction, and surface temperature for accurate and complete characterization of CMP processes and consumables.

    On-board diagnostics for better understanding of polishing processes
    • Delivers more visibility into transient polishing properties than any other system on the market
    • Collects data from the instant the substrate touches the pad and throughout the entire test
    • Enables early-stage process development decisions through more complete, detailed data

    Flexibility in sample type, size, and mounting configurations for widest applicability
    • Polishes any flat material, using virtually any conditioning disc, any slurry, and any pad
    • Accommodates small coupons and up to whole 100mm wafers with ease
    • Accepts multiple sample mounts for flexibility

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    PHI 710

    Auger Electron Spectroscopy (AES, Auger) is an analytical technique that provides compositional and distributional information of elements on the top few monolayers of a material by irradiating an electron beam to the surface of a solid material and measuring the energy of Auger electron emitted from the sample surface. The PHI 710 Scanning Auger Nanoprobe is a high performance surface analysis system that provides nanometer level Auger analysis. The acoustic enclosure and the built-in vibration isolators allow compositional and distributional measurement by 500,000 magnification that conventional Auger system never achieved.

    C-SAM (AW Series)

    The AW™ Series are advanced high-capacity, high throughput, automated C-SAM® instruments specialized for maximum sensitivity for evaluation of wafer bond applications. The AW Series delivers a better than 5 micron sensitivity, throughputs that are approximately two times faster than competitive systems and non-immersion scanners that eliminate false positives due to DI water ingression. The AW Series automatically handles, inspects and sorts boned wafers based on user-defined accept/reject criteria and are designed to handle wafers bonded by virtually any method, including direct fusion, anodic, glass frit and epoxy bonding.


    The D24™ is a semi-automated factory floor instrument capable of scanning boards and samples up to 24”, or accommodating up to six JEDEC trays of components at one time. The D24 delivers the robustness and accuracy of Sonoscan’s top lab instrument, but with very large area coverage capabilities. Plus, the analysis can be programmed to be performed without operator assistance, freeing your personnel for other duties while the inspection is in progress.

    The D24 accommodates even the largest boards and permits acoustic micro imaging of components mounted on the board. During the initial scan, each component is inspected while the D24 learns the x-y coordinates of each. It also learns the z coordinate and, equally important, the specific internal depth to be scanned. For a flip chip, for example, the level of interest may be the die-to-underfill interface. For a conventional IC package or a BGA, the level of interest may be the die attach. The D24 software can even store gating information for two or more depths of interest per component.

    Because not all components will have the exact same position from board-to-board, the D24 intelligently detects the x, y, and z coordinates and makes minor adjustments as needed, storing a detailed and highly accurate acoustic image of each component. It can also automatically analyze each image. For example, if it detects a void in a die attach layer, software measures the area of the void as a percentage of the whole die attach area. This makes it much easier to comply with standards such as Mil-Std-883, Method 2030, and makes it easier to determine the level of significance of any single defect.

    At the end of the scan, you’ll have a clear ""acoustic picture"" of the board. If there are a few components which should be replaced, you’ll know exactly which components they are, and the reason for rework. If the same component is defective on board after board, the problem can be identified and solved. The result is defect-free output with potentially no reduction in total throughput.

    C-SAM (GEN 6)

    The Gen6™ C-Mode Scanning Acoustic Microscope is the newest generation in Acoustic Microscopy Imaging (AMI) innovation. While taking the best from the Gen5™ (e.g. advanced features, aesthetics, and ergonomics), the Gen6 improves upon the rest and takes acoustic imaging to the next level.

    The Gen6 delivers the broadest range of capabilities available. Whether your needs are for nondestructive failure analysis, process development, R&D, High-Rel qualification for a military application, or low/medium-volume screening, the Gen6 is the one C-SAM system that can meet all of your demands. Gen6 is perfect for a variety of applications, such as; Microelectronics, MEMS, SSL LEDs, Power Modules, Solar, High-Tech materials, etc.

    As the ultimate laboratory analysis tool, the Gen6 includes SonoSimulator as a standard feature to simplify the analysis of devices with multiple thin layers.

    Advanced Sonoscan capabilities such as PolyGate™, Virtual Rescanning Mode (VRM™), and available Frequency Domain Imaging (FDI™) add value and confidence. With its large, easy-access, illuminated scanning area, the Gen6 has the capability to efficiently scan everything from a single part, to a 300mm wafer, with its tower referenced scan and fixtures.

    In addition to being packed with leading Sonoscan innovations, the Gen6 was carefully designed with the user in mind. Its ergonomic features make it comfortable and convenient to use. Its advanced applications Sonolytics™ software and new intuitive operator interface menus help maximize results, while saving operator time. Plus, its open access and illuminated tower referenced sample stage allow for easier loading and unloading of samples. The Gen6 is truly the new generation C-SAM, delivering a package of technology, ergonomics, and advanced Sonoscan-developed features that cannot be found anywhere else.

  • Handheld XRF

    The Vanta analyzer is our most advanced handheld X-ray fluorescence (XRF) device and provides rapid, accurate element analysis and alloy identification to customers who demand laboratory-quality results in the field.

    Vanta handheld XRF analyzers are built to be tough. Their rugged and durable design makes them resistant to damage for greater uptime and a lower cost of ownership.

    With intuitive navigation and configurable software, the Vanta series are easy to use with minimal training for high throughput and a fast return on investment. Featuring innovative and proprietary Axon technology, Vanta analyzers give you accurate results and help boost productivity no matter the environment or working conditions.

    Exceptional durability under extreme conditions.
    Analytical superiority.
    Optional Wireless LAN and Bluetooth® for real-time data sharing. Cloud technology enabled.
    Intuitive user interface.

  • Handheld XRF
    Delta Element

    The DELTA Element is the most affordable unit in the Olympus line-up of handheld X-ray fluorescence (XRF) analyzers designed for fast, accurate results. Fast, simple and reliable, the DELTA Element incorporates the features and rugged design of the DELTA family. With fast elemental ID for screening, sorting and metal analysis, the DELTA Element provides fast ROI for Scrap, PMI, QA / QC and Jewelry / Precious Metals applications.

    With a powerful X-ray tube and Si-PIN detector, the DELTA Element is ideal for simple applications. It provides quick ID, screening, sorting and elemental and metal analysis.

    The DELTA Element offers fast measurement with results in seconds, low limits of detection, and outstanding precision.

    The DELTA Element's field-worthy and rugged design features rubber overmolds and an ergonomic grip to protect the analyzer. To avoid downtime, the hot swap feature allows the batteries to be swapped out while the analyzer is in use. The DELTA Element features wide area heat sinks for high power use in extreme temperatures.

    Olympus' exclusive Grade Match Messaging (GMM) feature provides information to simplify verification and streamline operations. Users can assign customized messages to any grade and use real-time or pop-up messages for immediate sorting instructions and improved user efficiency.

  • NanoIndenter
    TI Premier

    The TI Premier Series was specifically designed to deliver industry-leading, quantitative nanomechanical characterization within a compact platform. Built upon proven Hysitron technology, the TI Premier provides an essential toolkit for your nanoscale mechanical and tribological testing. Routine measurements to advance research can be accomplished utilizing the versatile base configurations of the TI Premier, while numerous technique upgrade options are available to meet the potential diversity of your future characterization needs.
    The TI Premier Series offers systems tailored for quasi-static nanoindentation, high-temperature characterization, dynamic characterization, and testing over multiple length scales. Hysitron's TI Premier Series nanoindenters are configured with multiple application-specific characterization packages to provide a dedicated solution to your testing requirements.

  • NanoIndenter
    TI 950 TriboIndenter

    The TI 950 TriboIndenter nanoindenter has been developed as an automated, high throughput instrument to support the numerous nanomechanical and nanotribological characterization techniques developed by Hysitron. The TI 950 nanoindenter system incorporates the powerful performech® I Advanced Control Module, which greatly improves the precision of feedback-controlled nanomechanical testing, provides dual head testing capability for nano/micro scale connectivity, and offers unprecedented noise floor performance. The numerous nanomechanical testing techniques offered by Hysitron, as well as new testing methods currently being developed, make the TI 950 TriboIndenter an extremely versatile and effective nanomechanical characterization tool for the broadest range of applications.

  • NanoIndenter
    TI 980 TriboIndenter

    The TI 980 TriboIndenter is Hysitron's latest, most advanced nanomechanical test instrument that lies at the intersection of maximum performance, flexibility, reliability, usability, and speed. The TI 980 Nanoindenter is the next-generation of Hysitron's renowned TriboIndenter product family, building upon decades of technological innovation to deliver a new level of extraordinary performance, enhanced capabilities, and ultimate versatility in nanomechanical and nanotribological characterization.

    SmartSite RS

    The SmartSite RS is the world’s smallest portable stress analyzer that is especially designed for field analysis. It enables to characterize residual stress of metal parts ranging from large construction projects to individual products, e.g. bridges, maritime vessels, aircraft, aerospace equipment, pipelines, heavy machinery and automobiles.

  • Portable XRD

    The TERRA Mobile XRD System, a high performing, completely contained, battery operated, closed-beam portable XRD, provides full phase ID of major, minor and trace components with a qualitative XRF scan of elements Ca - U. Its unique, minimal sample prep technique and sample chamber allow for fast, in-field analysis.

    AutoMATE II

    Residual stress may be created during the manufacturing process of a material, or it may accumulate in a structure over many years in operation. In either case, this stress can have a serious negative effect on a product's quality, durability and lifetime. Accurate detection of residual stress is an important element of the quality control process and helps predict the service lifetime of products.

    In the past, if you wanted to make highly accurate residual stress measurements, you had to use an R&D diffractometer because of the accuracy of the goniometer. However this restricts the weight and size of the samples you can measure. On the other hand, dedicated laboratory and factory-floor residual stress analyzers suffer from reduced accuracy due to the nature of their mechanical designs, while, in their favor, they have the flexibility of measuring large and heavy parts.

    With the AutoMATE II, you now have the best of both worlds. Large and heavy parts (30 kg with standard manual Z stage; 20 kg with optional automated XYZ stage) can be measured with high accuracy. This is possible because the X-ray source and detector arm are mounted on a highly accurate two-axis goniometer that can position them relative to the measurement site and perform scans with an accuracy of 0.1 microns when using the automated XYZ stage.

    The most advanced new feature of the AutoMATE II lies in an innovative new X-ray detector. The detector used in the AutoMATE II is the D/teX Ultra1000, an electronic Si strip detector that has high dynamic range, high sensitivity, and good energy resolution, as well as not requiring any consumable gas.

    FastLine™ P300™

    "The FastLine™ P300™ Acoustic Microscope is specifically designed for accelerated inspection throughput in manual screening of microelectronic devices on the manufacturing floor. With an integrated design to minimize footprint, the FastLine is the new platform for Acoustic Microscopes.

    Every detail of the FastLine™ P300™ was engineered to match the way customers use Acoustic Microscopes for non automated production and process control. Simultaneous loading and scanning with Sonoscan’s unique carrier system allows one JEDEC style tray or reference tray to be scanned while a second tray is being safely loaded. The whole inspection process (handling, scanning and analysis) was considered, yielding the highest possible throughput.

    The new, more ergonomic design helps maximize productivity and improves the overall operator experience while minimizing the instrument footprint. FastLine™ P300™’s new Sonolytics™ Operator Interface, designed with the operator in mind, allows technicians to work with simplified and expanded features for production/process use in multiple languages.

    In addition, FastLine™ P300™ features a new electronics platform to meet current and next generation applications. New Movement Map™ technology delivers precise transducer positioning, while the Visual Poly-Gate™ mode allows for simple and instant multiple depth imaging. These innovative features along with the higher speed scanning mechanism make the FastLine™ P300™ system essential for any production line application.

    FACTS² ™

    "The FACTS²™ delivers state-of-the-art, automated in-line inspection for quality and process control. Delivering high throughput with minimal operator interaction, FACTS² simultaneously inspects two trays or modules with precision of ± 0.5 microns and utilizes multiple scan heads, improving throughput between two and seven times that of previous tools.

    FACTS²™ automatically inspects parts in JEDEC trays or Auer Boat carriers as part of an in-line process, ideal for high volume production environments. In addition, the FACTS² can also handle lead frame strips, IGBT power modules, multi-layer ceramic chip capacitors, flip chips and other components. The scanners utilize linear motor drives and mechanisms that virtually eliminate vibration by inertial balancing. Eliminating vibration and sample motion during scans allows for very narrow and precise layers of the samples to be isolated, gated and analyzed. This delivers the industry’s fastest image acquisition times.

    Once inspected, trays are moved to the drying chamber while a new inspection begins. Any previously hidden internal packaging defects, including voids, disbonds, delaminations and cracks, are clearly identified. Batch and lot data can be accessed either as images or tabulated analysis data from spreadsheets and tray maps. If desired, accept/reject criteria can be set to identify defective components within the data automatically. Defects can also be sorted into various categories based on your specific quality standards.

    Equipped with our industry preferred Sonolytics software platform and an SECS-II/GEM E30 interface—allowing for data to be tracked electronically via instrument-to-host communications in your factory environment, the FACTS² delivers the fastest automation inspection with maximum flexibility and is the ideal solution for production environments."

    D9™ Series

    The D9™ Series represents the modern standard for laboratory C-SAM instruments, specializing in failure analysis, process development, material characterization and low volume production inspection. Amply loaded with today's most advanced software, these instruments incorporate robust and accurate scanning features and expansive user conveniences to raise the performance level for laboratory acoustic microscopes. The D9 Series operates in both reflection and transmission modes, ensuring that all types of defects are correctly identified with the highest quality acoustic images available. The D9 Series makes scanning larger samples and trays of samples fast, easy and incredibly accurate.


    The Aspex Explorer is a designed for the automated imaging and elemental analysis of a wide spectrum of surfaces and particulate. The Aspex Explorer seamlessly provides high imaging, rapid non-destructive compositional analysis, and robust automation for size, shape and elemental composition.
    The Aspex Explorer is a microanalysis system that provides a fully integrated platform for addressing the micro-scale visualization of key surface features, as well as the needs of a diverse range of industries where stringent cleanliness and particle or inclusion contamination is critical. Its small physical footprint and low cost of ownership make it an ideal solution for operations interested in improving reliability and quality, while also minimizing production inefficiencies.

    A variety of industries from forensics to health sciences, to steel and automotive rely on the rugged hardware and sophisticated software of the Aspex Explorer as a fast and reliable platform for identifying particles as well as surface features.

    The Aspex Explorer with Automated Feature Analysis (AFA), provides a fast, accurate way for manufacturers in many industries to monitor and control the presence of contaminants that affect the quality of their products. For example, automotive parts manufacturers must control the level of particulate contaminants, which can cause failures in the field and impact their warranty programs. Steel makers are concerned with non-metallic inclusions, which degrade steel quality and can clog nozzles in production equipment. Monitoring the number and type of inclusions lets them adjust production chemistry to reduce the number of pour-backs and improve the quality of their products. AFA is valuable whenever rapid feedback of large sets of particle data is needed. The data sets can be trended and reviewed in real-time to identify and correct process issues. The ability to monitor and optimize an industrial process is critical for maximizing production efficiency and cost savings or ultimately, the profitability of the operation.

    PHI nanoTOF II

    Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS) is a surface analysis technique that provides compositions and images of surface molecules and elements with a top few atmic layers. TOF-SIMS can analyze from H+ to high mass number molecule ion (> 10.000amu) with a high mass resolution.
    PHI TRIFT V nanoTOF ™ achieves high spatial resolution and mass resolution by using triple focus hemispherical electrostatic analyzer which has excellent ion transmitting characteristics.PHI TRIFT V nanoTOF ™ also has high ability that can image samples with complex geometries without shadowing.


    The new Supermini200 has improved software capabilities as well as a better footprint. As the world's only high-power benchtop sequential wavelength dispersive X-ray fluorescence (WDXRF) spectrometer for elemental analysis of oxygen (O) through uranium (U) of almost any material, the Rigaku Supermini200 uniquely delivers low cost-of-ownership (COO) with high resolution and lower limits-of-detection (LLD).

    Simultix 14

    The newest version of our popular multi-channel simultaneous wavelength dispersive X-ray fluorescence (WDXRF) spectrometer system is the Simultix 14. Based on over 30 years of accumulated experience, the Simultix 14 stands out as the most advanced, fully automated system available — designed to meet today's analytical needs for utmost sensitivity, throughput, and versatility.

    PHI Quanterra II

    The Quantera II is the next generation of PHI’s highly successful scanning XPS microprobe product line. The Quantera II provides high sensitivity large and micro-area spectroscopy, superior inorganic and organic depth profiling, and the fully automated analysis of insulating or conductive samples.

    Important features of the Quantera II include:
    High sensitivity large area spectroscopy
    High performance micro-area spectroscoy
    Patented scanning x-ray source with a < 7.5 µm minimum beam size
    Secondary electron and XPS imaging
    Highest performance inorganic and organic sputter depth profiling
    Optional C 60 sputter ion gun
    Hands-off dual beam charge neutralization
    Robust ""Auto-Z"" sample alignment
    Robotic sample handling
    Fully automated and internet ready for remote operation
    Micro area spectroscopy and high performance thin film analysis capabilities open new areas of application for XPS surface analysis in all environments. The complete automation of the system makes it easy to use and increases the reproducibility of routine measurements. Large sample platens make it possible to analyze “real world” large samples or multiple small samples automatically. A new generation of XPS surface analysis instruments are available today from PHI.

    PHI X-Tool

    The PHI X-tool is the newest member of PHI’s suite of XPS instruments that also includes the PHI Quantera II and PHI VersaProbe II. The X-tool is designed to make XPS instrumentation accessible to a larger audience. An intuitive touch screen user interface, automatic sample loading, automatic analysis, and automatic report generation removes the requirement to be a surface analysis expert to perform XPS measurements.

    Based on PHI’s patented scanning XPS microprobe technology, the X-tool provides a robust environment for performing routine small and large area XPS measurements.

    In the automatic mode of operation a turnkey recipe driven analysis capability for repetitive analysis tasks or process monitoring is provided.

    In the interactive mode of operation, the user can define analysis conditions and guide an interactive research or failure analysis oriented analysis session. Analysis capabilities include: small and large area spectroscopy, XPS mapping, and sputter depth profiling. An internal optical microscope and x-ray beam induced secondary electron imaging are available to guide the selection of areas for analysis.

    If your XPS application is centered around repetitive analysis tasks or the need to make XPS available to a large group of users, the X-tool was designed for you.

    PHI VersaProbe II

    The VersaProbe II is the next generation of PHI's highly successful Multi-Technique Scanning XPS Microprobe, which features a new software user interface for instrument operation and a new 128 channel detector. The VersaProbe II is based on PHI’s scanning x-ray microprobe technology, that provides high performance XPS large area spectroscopy, superior micro-area spectroscopy, chemical imaging, and secondary electron imaging with a raster scanned 10 µm diameter x-ray beam.

    PHI’s innovative and patented dual beam charge neutralization method provides turn-key analysis of insulating samples using a combination of low energy ions and electrons.

    The integral floating column argon ion gun provides an impressive sputter depth profiling capability for inorganic thin film structures. Optional C60+ and Ar2500+ cluster source ion guns provide a unique and powerful organic sputter depth profiling capability.

    SmartLab 3 (XRD)

    The SmartLab 3 is a highly versatile multipurpose X-ray diffractometer with built-in intelligent guidance. It offers continued refinement of the original ease of use features that enabled the original SmartLab to receive the R&D 100 Award in 2006: automatic alignment, component recognition, cross beam optics and a five axis goniometer.

    SmartLab (XRD)

    The SmartLab is the most novel high-resolution diffractometer available today. Perhaps its most novel feature is the SmartLab Guidance software, which provides the user with an intelligent interface that guides you through the intricacies of each experiment. It is like having an expert standing by your side.
    The system incorporates a high resolution θ/θ closed loop goniometer drive system, cross beam optics (CBO), an in-plane scattering arm, and an optional 9.0 kW rotating anode generator.
    Coupling a computer controlled alignment system with a fully automated optical system and the Guidance software makes it easy to switch between hardware modes, ensuring that your hardware complexity is never holding back your research.
    Whether you are working with thin films, nanomaterials, powders, or liquids the SmartLab will give you the functionality to make the measurements you want to make when you want to make them.

    ZSX Primus (XRF)

    Rigaku ZSX Primus delivers rapid quantitative determination of major and minor atomic elements, from beryllium (Be) through uranium (U), in a wide variety of sample types — with minimal standards.
    The latest instrument in Rigaku's ZSX series, the ZSX Primus continues the tradition of delivering accurate results in a timely and seamless manner, with unsurpassed reliability, flexibility, and ease of use to meet any challenges in today's laboratory.
    Providing superior performance with the flexibility for analyzing the most complex samples, the ZSX Primus features a 30 micron tube, the thinnest end-window tube available in the industry, for exceptional light element (low-Z) detection limits. Combined with the most advanced mapping package to detect homogeneity and inclusions, the ZSX Primus allows easy detailed investigation of samples that provide analytical insights not easily obtained by other analytical methodologies. Available multi-spot analysis also helps to eliminate sampling errors in inhomogeneous materials.
    EZ-scan allows users to analyze unknown samples without any prior setup. This time saving feature requires only a few clicks of the mouse and a sample name to be entered. Combined with SQX fundamental parameters software, it provides the most accurate and rapid XRF results possible. SQX is capable of automatically correcting for all matrix effects, including line overlaps. SQX can also correct for secondary excitation effect by photoelectrons (light and ultra-light elements), varying atmospheres, impurities and different sample sizes. Increased accuracy is achieved using matching library and perfect scan analysis programs.


    X-Ray shielded cabinet complies with Italian regulation (DPR 257/2001) and the strictest international regulations for fully shielded radiation devices. The cabinet is completely self-contained. Manufactured in steel with complete lead shielding. The cabinet can be transported by fork-lift. The cabinet does not require any further shielding and can be located safely in any workplace area.
    The cabinet is designed with a large double sliding doors for casting loading with two lead/glass inspection window. High speed doors movement controlled by inverter with ramps up and down.
    Safety light curtain on the loading door.

    The inspection positions are obtained by the movement of the complete X-Ray system without any C-arm, coordination and alignment between source and detector is controlled by software.
    This solution allows a significant increase in the speed of handling and positioning. Software allows the dynamic tilt axis in accordance with casting position on zoom horizontal axis.
    Turntable able to move on three axes with continuous rotation on 360 degrees.
    A mechanical magnification axis guarantees linear and constant magnification factor.
    To make more comfortable loading operation, turntable comes out from the loading door.
    Motorized and programmable two axes anti-blooming shutter.
    7 independent handling axes (2 additional axes for motorized programmable shutter on X-Ray source) moved by brushless motors with absolute encoders on board.
    This equipment does not require zero setting of axes.
    Positioning speed up to 15 meters/minute.
    The machine can accommodate and inspect for casting 700 x 1200mm, weight 80kg.

    The SRE M@X could be equipped with different combinations of generators/tubes, different power are available, from 130kV till 225kV (1600W). X-Ray sources (tubes) with different focal spot depending from the need. Typically equipped with a double focal spot 0,4 x 0,4mm (d=1.0 according to EN12543) 160kV 640W metal-ceramic tube. Now also available the new High Power (1800W) double focal spot 0,15 x 0,15mm/0,4×0,4mm (d=0,4 mm/d=1.0mm according to EN12543), available also 225 kV version.
    Image intensifier XRI 420 industrial version, input window 9 inches and 3-magnification fields switchable and programmable by PC.
    High resolution CCD digital camera, up to 1000×1000 pixels at 30 progressive frames/second, 12-bit or amorphous silicon digital Flat Panel Detector, ADC 14/16 bits, resolution 200µ



    X-Ray shielded cabinet complies with Italian regulation (DPR 257/2001) and the strictest international regulations for fully shielded radiation devices. The cabinet is completely self-contained. Manufactured in steel with complete lead shielding. The cabinet can be transported by fork-lift. It does not require any further shielding and can be located safely in any workplace area. Designed with a double sliding doors for casting loading with a lead/glass inspection window.

    The inspection positions are obtained by the movement of the complete X-Ray system on the vertical axis, coordination and alignment between source and detector is controlled by software (CNC version). This solution allows a significant increase in the speed of handling and positioning. Software allows the dynamic tilt axis in accordance with casting position on zoom horizontal axis.
    Turntable able to move on 4 axes with continuous rotation on 360 degrees.
    A mechanical magnification axis guarantees linear and constant magnification factor.
    Motorized and programmable two axes anti-blooming shutter.
    6 independent handling axes (2 additional axes for motorized programmable shutter on X-Ray source), moved by brushless motors with absolute encoders on board. This equipment does not require zero setting of axes.
    Positioning speed increased to 15 meters/min.
    The machine can accommodate and inspect for casting 500 x 700mm, weight 25 kg.

    The SRE HEX could be equipped with different combinations of generators/tubes, different power are available, from 130kV up to 225kV (1600W). X-Ray sources (tubes) with different focal spot depending on the need. Image intensifier XRI 420 industrial version, input window 9 inches and 3 magnification fields switchable and programmable by PC.
    High resolution CCD digital camera up to 1000×1000 pixels at 30 progressive frames/second at 12-bit or amorphous silicon digital Flat Panel Detector, ADC 14/16 bits, resolution 200µ



    X-Ray shielded cabinet complies with Italian regulation (DPR 257/2001) and the strictest international regulations for fully shielded radiation devices. The cabinet is completely self-contained. Manufactured in steel with complete lead shielding. The cabinet can be transported by either crane or fork-lift. The cabinet does not require any further shielding and can be located safely in any workplace area. The cabinet is designed with a large maintenance access door at the front and is also available with lead/glass inspection window. Wheel entrance and exit tunnels with two sliding doors each end which allows for faster cycle times.

    The equipment is able to operate with different designs and sizes of wheels coming randomly from the production platforms. Rotating controlled axis on 360° revolution of wheel moved by four independent motors, very strong and powerful mechanical-pneumatic gripping mechanism. Five axes of movement guaranties that all inspection angles can be easily achieved. The movement of the X-Ray source and detector is achieved without the traditional C arm design. The accurate alignment of X-Ray source and detector is achieved in software, saving weight, simplifying design and reducing machine cycle times. A Mechanical magnification axis guarantees linear and constant magnification factor. External roller conveyor with inlet sequencer and rejection pusher can be supplied as an option.

    The Thunder 3 is equipped with a Bosello HT made High Voltage generator type XRG 160, high performance equipment 160 KV -10 mA 640 W max. Coupled with double focal spot 0,4 x 0,4 mm ( d=1.0 according to EN12543) 160 KV 640 W metal-ceramic tube XRT 160-0.4. Image intensifier XRI 420 industrial version, input window 9 inches and 3-magnification field switchable and programmable by PC. ( only with image intensifier). Now is also available with amorphous silicon digital Flat Panel Detector, ADC 14/16 bits, resolution 200µ

    An operator panel with the main functions pushbuttons and joysticks for axes movement is located in an ergonomic air conditioned console, also a 15” touch screen display for user interface and programming, a Radioscopic image monochromatic high resolution 17” monitor is also provided. A Computer installed with BOSELLO BHT software controls all functions of the equipment, it is interfaced to a PLC for the loading operations and diagnostics, all axes movements are controlled from the PC through a remote microprocessor controller. The Standard version offers, in addition to the usual working programs, diagnostic programs for optimizing trouble shooting and maintenance operations. The inspection programs are made by a teach-in software which allows for the storage several kinds of wheel programs. X-Ray KV and mA variation is also automatically controlled by RS 232 serial line. The Personal Computer can be connected to the peripheral devices (printers etc.) Ethernet port is also available for connection with a local area network or to us for remote diagnostic and service. Automatic wheel identification (AWI) and automatic analysis software (VISUAL FARIS) are optionally available.
    The WRE THUNDER 3 equipment is the fastest solution for the on-line inspection of alloy wheels. It has been designed to overcome the handling problems of large and heavy wheels. The machine has also been designed to cope with flashing left on the wheel. This equipment has a strong and robust mechanical structure, designed for long and continuous use in the industrial environment. WRE THUNDER 3 is very innovative because the inspection positions are obtained by the movement of the complete X-Ray system without any C-arm. The X-Ray tube is moved by 2 handling axes and the Image Intensifier is moved by 3 handling axes. Coordination and alignment between source and detector is controlled by software. This design concept allows us to produce a very compact cabinet, the dimensions allows customers to place it in small spaces, installation is easy and the machine can be relocate quickly if necessary. This design solution has allowed us to reduce to 2 seconds or less, the non productive time (idle time), this makes our machine the fastest available on the market.

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