• Accelerating Semiconductor Processes Control with Advanced 3D Optical Metrology 

    Date Posted : 26 Oct 2021

    Event Date  :   03 Nov 2021 - 03 Nov 2021
    Event Venue  :   @Online Webinar

    Monitoring the in-line quality control of wafers during production is of major importance in both front and back end of semiconductor processes.
    Recent technology advances in 3D Optical Metrology have helped ensure there are minimum defects in the final products.

    Join this webinar to update your knowledge on 3D White Light Interferometer (WLI), a non-contact metrology system that improves yield, identifies root cause failure and drive the next generation device development from bare wafer to final packaged devices. The speaker will present holistic solutions for 300mm and 600mm wafer panels; as well as hold technical discussions on denser interconnect networks, finer redistribution layer (RDL), wafer fan-out packaging, CMP and IC Substrate.

    Recent advances in 3D Optical Metrology accelerate in-line quality control for both front and back end processes. In this webinar, we present case studies that address improving yield, identifying root cause failure and driving next generation device development from bare wafer to final packaged device.

    We will highlight requirements for advanced telecommunication, compact on-board electronics, and electric vehicles covering metrology needs for denser interconnect networks, finer redistribution layer (RDL), direct wafer to wafer bonding and wafer fan-out packaging.

    Front end (FEOL) examples will include:

    Wafer bin roughness and edge roll-off
    CMP efficiency full die flatness
    CD metrology including TSV, deep trench RIE (Bosch process)
    Epi layer defect quantification in high power devices

    Back end (BEOL) and packaging examples will address:

    Under Bump Metallization (UBM)
    Recess defect inspection
    Full die screening for dense interconnect control


    Webinar info
    -----------
    Date: Wednesday, 3rd November 2021
    Time: 2pm gmt+8

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